12 Layer ENIG FR4 Blind Vias PCB
Ihe HDI PCB
Ngwa HDI PCB bụ RCC, LDPE, FR4
RCC:Ọla kọpa resin dị mkpụmkpụ maka foil ọla kọpa ejiri resin kpuchie ya.RCC mejupụtara foil ọla kọpa na resin na elu siri ike, nguzogide okpomọkụ na ọgwụgwọ oxidation (eji mgbe ọkpụrụkpụ karịrị 4mil) .The resin oyi akwa nke RCC nwere otu processability dị ka FR4 adhesive mpempe akwụkwọ (prepreg).Na mgbakwunye, ọ kwesịkwara izute mkpa arụmọrụ dị mkpa nke laminate, dị ka:
(1) Elu mkpuchi mkpuchi na micro site na ntụkwasị obi;
(2) Igwe ọkụ mgbanwe dị elu (TG);
(3) Obere dielectric mgbe niile na nnabata mmiri;
(4) Ọ nwere nnukwu adhesion na ike na foil ọla kọpa;
(5) Mgbe ọgwụgwọ gasịrị, ọkpụrụkpụ nke mkpuchi mkpuchi bụ otu
N'otu oge ahụ, n'ihi na RCC bụ ụdị ngwaahịa ọhụrụ na-enweghị eriri iko, ọ na-enye aka na ọgwụgwọ laser na plasma etching, ma na-eme ka efere multi-layer dị arọ ma dị mkpa.Na mgbakwunye, foil ọla kọpa resin mkpuchi nwere 12pm, 18pm dị mkpa ọla kọpa, dị mfe nhazi.
Ngosipụta akụrụngwa
PCB akpaghị aka plating Line
PCB PTH ahịrị
PCB LDI
Igwe ihe ngosi PCB CCD
Ihe ngosi ụlọ ọrụ
Ebe nrụpụta PCB
Onye nnabata onye nchịkwa
Ụlọ Nzukọ
