12 Layer FR4 ENIG Impedance Control PCB

1. PCB sekit osisiiji tụlee ntinye na ntinye nke ngwa eletriki, emesia SMT patch ntinye dịkwa mkpa iji tụlee conductivity na mgbaàmà nnyefe ọrụ na ndị ọzọ okwu, ya mere ọ ga-achọ impedance dị ka ala dị ka o kwere mee.

2. PCB circuit osisi na mmepụta usoro nke ọla kọpa deposition, tin plating (ma ọ bụ electroless plating, na-ekpo ọkụ ịgba tin), soldering na ndị ọzọ Filiks, ihe eji ga-achọ ala resistivity, iji hụ na mkpokọta impedance uru nke sekit osisi ka. izute ogo ngwaahịa achọrọ, ka ọ rụọ ọrụ nke ọma.

3. PCB sekit osisi tin plating bụ ihe kasị adịkarị mfe nsogbu na dum sekit osisi mmepụta, bụ isi njikọ na-emetụta impedance;ya nnukwu ntụpọ bụ mfe ọxịdashọn ma ọ bụ deliquescence, ogbenye brazing, nke mere na sekit osisi siri ike solder, impedance dị oke elu, na-akpata adịghị mma conductivity ma ọ bụ ejighị n'aka arụmọrụ nke dum osisi.

4. Onye na-eduzi na bọọdụ sekit PCB ga-enwe mgbasa ozi dị iche iche, eriri n'onwe ya n'ihi etching, ọkpụrụkpụ laminate, obosara waya na ihe ndị ọzọ, ga-eme ka mgbanwe mgbanwe nke impedance, mee ka mgbagha mgbagha, na-eduga na arụmọrụ nke bọọdụ sekit na-adalata, ya mere ọ dị mkpa iji chịkwaa uru impedance na mpaghara ụfọdụ.