Kachasị mma 4 Layer ENIG SF302+FR4 siri ike-Flex PCB emeputa na ụlọ ọrụ |Huihe sekit

4 Layer ENIG SF302+FR4 PCB siri ike-Flex

4 Layer ENIG SF302+FR4 Rigid-Flex PCB egosipụtara

Nkọwa dị mkpirikpi:

oyi akwa: 4
Nhazi Pụrụiche: Board siri ike-Flex
Ngwunye elu: ENIG
Ihe onwunwe: SF302+FR4
Ụzọ Mpụga W/S: 5/5mil
Track ime ime W/S: 6/6mil
Ọkpụrụkpụ osisi: 1.0mm
Min.Dayameta oghere: 0.3mm

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Nkọwa ngwaahịa

Isi ihe maka nlebara anya na imewe nke mpaghara nchikota na-agbanwe agbanwe

1. The akara kwesịrị ịgbanwe were were, na ntụziaka nke akara kwesịrị perpendicular na-ehulata direction.

2. A ga-ekesa onye na-eduzi ya n'ụzọ ziri ezi n'ofe mpaghara na-ehulata.

3. A ga-eme ka obosara nke onye na-eduzi ya dịkwuo elu n'ime mpaghara ahụ na-ehulata.

4.PTH imewe ekwesịghị iji mee ihe na mpaghara mgbanwe mgbanwe siri ike.

5.Bending radius nke ekwe mpaghara nke isiike na-agbanwe PCB

Ihe nke PCB na-agbanwe agbanwe

Onye ọ bụla maara ihe ndị siri ike, na ụdị ihe FR4 na-ejikarị eme ihe.Agbanyeghị, ekwesịrị iburu n'uche ọtụtụ ihe achọrọ maka ngwa PCB na-agbanwe agbanwe.Mkpa ka adabara adhesion, ezigbo okpomọkụ na-eguzogide, iji hụ na isiike flexural bonding akụkụ nke otu ogo mgbasa mgbe kpo oku na-enweghị deformation.Ndị nrụpụta izugbe na-eji usoro resin nke PCB ihe siri ike.

Maka ihe ndị na-agbanwe agbanwe, họrọ mkpụrụ osisi na ihe nkiri mkpuchi nwere obere mgbasawanye na nkwekọrịta.Na-ejikarị ihe nrụpụta PI siri ike, kamakwa iji mkpụrụ na-abụghị nrapado eme ihe maka mmepụta.Ngwa flex bụ ndị a:

Isi ihe: FCCL (ọla kọpa na-agbanwe agbanwe)

PI.Polymide: Kapton (12.5 um / 20 um / 25 um / 50 um / 75um).Mgbanwe dị mma, nkwụsi ike dị elu (okpomọkụ eji ogologo oge bụ 260 ° C, obere oge 400 Celsius C), nnabata mmiri dị elu, ezigbo ọkụ eletrik na njiri arụ ọrụ, ezigbo mgbochi mmiri.Ezigbo nguzogide ihu igwe, nguzogide kemịkalụ na ire ọkụ.Polyester imide (PI) bụ nke a na-ejikarị eme ihe.PET.Polyester (25um / 50um / 75um).Dị ọnụ ala, ezigbo mgbanwe na mgbochi anya mmiri.Ezigbo ihe eji arụ ọrụ na eletriki dị ka ike nkwụsị, ezigbo mmiri na-eguzogide na hygroscopicity.Ma mgbe a na-ekpo ọkụ, ọnụ ọgụgụ nke ntanye dị ukwuu na oke okpomọkụ na-eguzogide adịghị mma.Ọdịghị mma maka ire ere okpomọkụ dị elu, ebe mgbaze 250 ° C, ejiri obere ya mee ihe

Na-ekpuchi Membrane

Ọrụ bụ isi nke ihe nkiri mkpuchi ahụ bụ iji chebe sekit ahụ, gbochie sekit site na mmiri, mmetọ na ịgbado ọkụ. The Conductive Layer nwere ike ịbụ Rolled Annealed Copper, Electrodeposited Copper na Silver Ink.Ọdịdị kristal nke ọla kọpa electrolytic bụ ihe siri ike, nke na-adịghị eme ka mkpụrụ osisi dị mma.Ọdịdị kristal ọla kọpa calended dị ire ụtọ, mana nrapanye na ihe nkiri isi adịghị mma.Enwere ike ịmata ọdịiche dị na ọdịdị nke ntụpọ na mpịakọta ọla kọpa.Electrolytic ọla kọpa foil bụ ọla kọpa ọbara ọbara, calendering ọla kọpa foil bụ isi awọ ọcha.Ngwa ndị agbakwunyere & Ndị na-agba ume: Nke a na-agbanye n'akụkụ PCB flex maka ihe mgbado ọkụ ma ọ bụ tinye ihe siri ike maka nrụnye.Ihe nkiri na-eme ka ọ dị ike dị FR4, efere resin, nrapado nwere mmetụta nrụgide, nchara mpempe akwụkwọ aluminum, wdg.

Mpempe akwụkwọ na-adịghị agwụ agwụ/Ọdị ala Gluo gwọchara ọkara (Obere Flow PP).A na-eji njikọ siri ike na Flex maka PCB flex siri ike, na-abụkarị PP dị gịrịgịrị.

Nke gara aga: 8 oyi akwa HASL FPC+FR4 PCB siri ike-Flex

Osote: 4 oyi akwa FPC+FR4 PCB Flex siri ike

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