8 Layer ENIG FR4 Via-In-Pad PCB
Ihe kacha sie ike ijikwa oghere nkwụnye na via-in-pad bụ bọọlụ na-ere ahịa ma ọ bụ pad na ink dị na oghere.N'ihi mkpa ọ dị iji nnukwu njupụta BGA (bọl grid array) yana miniaturization nke SMD mgbawa, ngwa nke teknụzụ oghere tray na-abawanye.Site na nke a pụrụ ịdabere na ya site na usoro ndochi oghere, teknụzụ oghere dị na efere nwere ike itinye n'ọrụ na imepụta na imepụta bọọdụ multilayer dị elu, ma zere ịgbado ọkụ na-adịghị mma.HUIHE Circuit na-eji teknụzụ via-in-pad ruo ọtụtụ afọ, ma nwee usoro mmepụta nke ọma na ntụkwasị obi.
Parameters nke Via-In-Pad PCB
| Ngwaahịa ndị a ma ama | Ngwaahịa pụrụ iche | Ngwaahịa pụrụ iche | |
| Ọkọlọtọ ndochi oghere | IPC 4761 Ụdị VII | IPC 4761 Ụdị VII | - |
| Dayameta Min oghere | 200µm | 150µm | 100µm |
| Oke mpe mpe akwa | 400µm | 350µm | 300µm |
| Dayameta oghere kacha | 500µm | 400µm | - |
| Oke mpe mpe akwa | 700µm | 600µm | - |
| Obere ntụtụ | 600µm | 550µm | 500µm |
| Akụkụ akụkụ: Conventional site na | 1:12 | 1:12 | 1:10 |
| Akụkụ akụkụ: kpuru ìsì site na | 1:1 | 1:1 | 1:1 |
Ọrụ nke Plug Hole
1.Igbochi tin si na-agafe oghere conduction site n'elu akụrụngwa n'oge ife soldering
2.Avoid flux residue na site-oghere
3.Prevent tin bọọlụ si na-apụta n'oge ire ere, na-akpata obere sekit
4.Prevent elu solder mado si eruba n'ime oghere, na-eme ka virtual ịgbado ọkụ na-emetụta dabara adaba.
Uru nke Via-In-Pad PCB
1.Mmelite ikpo ọkụ ọkụ
2.The voltaji na-eguzogide ikike nke vias ka mma
3.Nye ebe dị larịị ma na-agbanwe agbanwe
4.Lower parasitic inductance
Uru Anyị
1. Ụlọ ọrụ nke onwe, ebe mmepụta ihe 12000 square mita, ụlọ ọrụ mmepụta ihe kpọmkwem ahịa
2. Ndị ahịa na-ere ahịa na-enye ngwa ngwa na elu-mma ahịa tupu ahịa na mgbe-ahịa ahịa
3.Process dabeere na nhazi nke PCB imewe data iji hụ na ndị ahịa nwere ike nyochaa ma kwenye na oge mbụ
